Physical Design

Turning RTL into Manufacturable Silicon

At Tenasic, we specialize in Physical Design solutions that transform verified RTL into fully manufacturable silicon. Our team combines advanced process node experience with proven industry tools and flows to deliver optimized layouts that meet the toughest performance, power, and area requirements.

From block-level to full-chip implementation, we manage the complexity of physical design with a silicon-first mindset—delivering designs that are not only functional, but also production-ready and yield-optimized.

Expertise In Every Layer

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End-to-end solution​

  • Complete solution from physical-aware design planning, full chip floorplan prototyping to implementation
  • Integrated implementation flow from synthesis, place and route, signoff to tapeout​
  • Proven track record of multiple SoC full-mask tapeouts in advanced process node

High performance convergence​

  • Experienced in converging high performance design​
  • Optimize performance, power and area (PPA) with engineering judgement and tradeoff​
  • Proven convergence in high-performance CPU core and Coherent NoC IP development​
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Technician plug in CPU

Low power expertise​

  • Experienced in low power design techniques​
  • Integrated static and dynamic power optimization throughout place and route flow​
  • Proven low power design in high-efficiency CPU core IP development and complex power domain handling in SoC design

Silicon proven signoff​

  • Silicon proven timing, low power static check, EM/IR, DRC/LVS signoff methodology
  • Expert in handling design collateral such as timing constraint (SDC) and low power intent (UPF)​
  • Quality assurance check on netlist and design collateral to ensure implementation effectiveness and signoff efficiency​
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Schedule and risk management​

  • Highly experienced team in ensuring meeting target schedule with quality tapeout​
  • Constant risk monitoring and management throughout project cycle